Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2007-06-26
2007-06-26
Dinh, Paul (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
Reexamination Certificate
active
10927919
ABSTRACT:
The present invention optimizes the dynamic power characteristics of an integrated circuit (IC) chip. The IC chip includes a plurality of layers, wherein at least one of the layers is a power mesh layer that provides power to the IC chip, and includes a ground (Vss) net. The method includes providing at least one dummy metal mesh layer, and coupling the dummy metal mesh layer to the Vss net on the power mesh layer thereby increasing the capacitance on the Vss net.
REFERENCES:
patent: 5264729 (1993-11-01), Rostoker et al.
patent: 5898403 (1999-04-01), Saitoh et al.
patent: 6198362 (2001-03-01), Harada et al.
patent: 6617621 (2003-09-01), Gheewala et al.
patent: 6969808 (2005-11-01), Shiraki
patent: 2004/0088669 (2004-05-01), Loh et al.
patent: 2004/0158805 (2004-08-01), Kanamoto et al.
patent: 2004/0170043 (2004-09-01), Theel
patent: 2004/0217479 (2004-11-01), Katsura et al.
patent: 2004/0222528 (2004-11-01), Kunikiyo
patent: 2005/0115740 (2005-06-01), Sasaki et al.
patent: 2005/0123677 (2005-06-01), Nicolaisen
patent: 2005/0181546 (2005-08-01), Madurawe
patent: 2005/0230146 (2005-10-01), Koyama
patent: 2006/0055049 (2006-03-01), Nelson et al.
Raman Santhanakris
Shrowty Vikram
Dinh Paul
LSI Corporation
Parihar Suchin
Strategic Patent Group
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