Optimized integral heat pipe and electronic circuit module arran

Details Optimized integral heat pipe and electronic circuit module arran Optimized integral heat pipe and electronic circuit module arran

1992-01-14

1993-06-01

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

16510433, 174 152, 257715, H05K 720

Patent

active

052165809

ABSTRACT:
An optimized integral heat pipe and electronic circuit module arrangement is described. A ceramic multi-chip module bearing electronic circuit components has applied to the side opposite the electronic circuit components preparatory metallization and a thermal wick. A heat pipe evaporator chamber and condenser assembly is attached to the multi-chip module and wick assembly. A suitable working fluid is introduced into the vapor chamber and the vapor chamber hermetically sealed. Application of the thermal wick to the heat producing multi-chip module eliminates the thermal impedance contributed by thermal transmission media used in prior art heat pipe assemblies, permitting a doubling of heat flux from the multi-chip module to the heat pipe evaporator.

REFERENCES:
patent: 4019098 (1977-04-01), McCready et al.
patent: 4407198 (1977-09-01), Sekhon
patent: 4833567 (1989-05-01), Saaski
patent: 4995451 (1991-02-01), Hamburgen
patent: 5095404 (1992-03-01), Chao

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