Integrated circuit socket with reed-shaped leads

Details Integrated circuit socket with reed-shaped leads Integrated circuit socket with reed-shaped leads

1990-11-20

1992-02-18

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439330, 439912, H01R 2372

Patent

active

050889303

ABSTRACT:
A socket has several upwardly extending resilient single-reed-shaped contacts that connect to downwardly extending portions of leads of an integrated circuit package. A bottom section supports these contacts and the leads of the socket, which are connected to the contacts. The contacts may be integral to lead frame elements, make a wiping contact over at least half of the downward section or at least 0.02 inches, extend from the bottom surface of the package, press inwardly or outwardly against the package leads, and are separated and maintained in registration by ribs. A top section with ribs separates and maintains the package leads in registration and a resilient reed retains the package in the top section. A pin-and-socket connector maintains the top section in place. The package leads are retained by a surface against the force applied by the contacts. The socket leads are pins supported by the bottom section and are connected to a lead frame element and the bottom section is made of a molded thermoplastic in which the elements are at least partially embedded. The socket leads and contacts are integral to the same lead frame elements and may be adapted for through-hole insertion or surface mount and may have the same footprint as the package. The socket may include a cover.

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Brochure, AMP Micro-Pitch Socket for Jedec Plastic Quad Flat Pack ICs, 6 pages.
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Advanced Interconnections, sketches, 6 pages.

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