Optimized grooving structure for a CMP polishing pad

Details Optimized grooving structure for a CMP polishing pad Optimized grooving structure for a CMP polishing pad

2007-08-07

2007-08-07

Wilson, Lee D. (Department: 3723)

Abrading

Flexible-member tool, per se

Interrupted or composite work face

C451S533000, C451S550000

Reexamination Certificate

active

10924835

ABSTRACT:
A polishing pad for a chemical mechanical polishing has a body rotatable in a predetermined direction and having a working surface, the working surface being provided with grooves, the grooves being formed so that over the course of a single revolution of the pad said grooves extend in all directions in the plane of the working surface. Such an arrangement of grooves is the optimum configuration for CMP, especially copper CMP.

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