Optimization to avoid sidelobe printing

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

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C430S005000, C700S121000, C382S144000

Reexamination Certificate

active

07496882

ABSTRACT:
A method for configuring the optical transfer of a mask pattern onto a substrate using a lithographic apparatus is presented. In an embodiment of the invention, the method includes calculating a size of a printed sidelobe to be generated as a result of optical transfer of the mask pattern onto the substrate; and determining a plurality of lithographic parameters for optical transfer of the mask pattern onto the substrate that yields an optimization of a high latitude for the mask pattern and a small printed sidelobe size.

REFERENCES:
patent: 5700606 (1997-12-01), Kobayashi et al.
patent: 6020988 (2000-02-01), Deliwala et al.
patent: 6248988 (2001-06-01), Krantz
patent: 6291113 (2001-09-01), Spence
patent: 6329112 (2001-12-01), Fukuda et al.
patent: 6418553 (2002-07-01), Yamada et al.
patent: 6593033 (2003-07-01), Ma et al.
patent: 6680150 (2004-01-01), Blatchford et al.
patent: 6696208 (2004-02-01), Czech et al.
patent: 6905621 (2005-06-01), Ho et al.
patent: 2004/0069745 (2004-04-01), Ho et al.
patent: 2005/0273753 (2005-12-01), Sezginer
patent: 2006/0256311 (2006-11-01), Hansen et al.
Bruce W. Smith, “Forbidden Pitch or Duty-Free: Revealing the Causes of Across-Pitch Imaging Differences,” Microelectronic Eng. Dept, Rochester Institute of Technology (Rochester, NY), 9 pages.
Rieger et al., “Layout Design Methodologies for Sub-Wavelength Manufacturing ,” DAC 2001, Las Vegas, Nevada ( Jun. 18-22, 2001), 4 pages.
Rieger et al., “Layout Design Methodologies for Sub-Wavelength Manufacturing,” Avant! Corporation, 20 pages.

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