Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing
Reexamination Certificate
2007-10-30
2007-10-30
Jarrett, Ryan A (Department: 2125)
Data processing: generic control systems or specific application
Specific application, apparatus or process
Product assembly or manufacturing
C700S110000
Reexamination Certificate
active
10892013
ABSTRACT:
A method to optimize semiconductor processing equipment (hardware settings and process conditions) to minimize non-uniformities within a wafer based on linescan measurements and a calculation of or prediction for a polar map. Measurements of a metrology value are taken at a number of points along a linescan (or two orthogonal linescans) on the wafer surface for a number of wafer processed in a set of experiments in which one equipment setting or process parameter is adjusted per experiment. The raw data are then normalized and weighted in accordance with the radial distance from the center of the wafer. Standard deviations of different metrology values within the wafer are then calculated. The setting can then be further adjusted to predict and to minimize the standard deviations, and therefore non-uniformity of the metrology values within the wafer, using the method without processing any additional test wafers.
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ASM America Inc.
Jarrett Ryan A
Knobbe Martens Olson & Bear LLP
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