Optically monitoring the undercutting of a layer being etched

Details Optically monitoring the undercutting of a layer being etched Optically monitoring the undercutting of a layer being etched

1976-06-21

1977-08-02

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 156657, 156659, 350162R, 356152, H01L 21306

Patent

active

040393704

ABSTRACT:
A technique for optically monitoring the undercutting of a layer of material being selectively etched beneath a pattern of masking material in an etchant comprises forming on a layer of the material being etched a diffraction grating pattern including spaced strips of masking material having a strip width W, exposing the diffraction grating pattern, while positioned in the etchant, to a beam of monochromatic light, whereby the grating pattern together with the layer of material therebeneath functions as a relief pattern which diffracts the beam of light into diffracted beams of various orders, and then monitoring certain of said diffracted beams to determine when a sharp decrease in the intensity thereof occurs, such a sharp decrease indicating an undercutting equal to a distance of W/2.

REFERENCES:
patent: 3533340 (1970-10-01), Macovski
patent: 3720515 (1973-03-01), Stanley
patent: 3802940 (1974-04-01), Villers et al.
patent: 3874959 (1975-04-01), Hoekstra et al.
patent: 3885877 (1975-05-01), Horwath et al.
patent: 3953265 (1976-04-01), Hood

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