Optical waveguides – Accessories – External retainer/clamp
Reexamination Certificate
2000-01-12
2001-10-02
Bovernick, Rodney (Department: 2874)
Optical waveguides
Accessories
External retainer/clamp
C385S059000, C385S049000
Reexamination Certificate
active
06298192
ABSTRACT:
CLAIM OF PRIORITY
This application makes reference to, incorporates the same herein, and claims all benefits accruing under 35 U.S.C. §119 from our application OPTICAL WAVEGUIDE DEVICE AND METHOD FOR FABRICATING THE SAME filed with the Korean Industrial Property Office on Jan. 12, 1999 and there duly assigned Ser. No. 534/1999.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an optical waveguide device and a method for fabricating the optical waveguide device, and more particularly to an optical waveguide device having a structure capable of allowing the optical waveguide device to be easily connected with an optical fiber array connector.
2. Description of the Related Art
In order to appropriately couple an optical fiber to an optical waveguide device, an active alignment method has conventionally been used. In accordance with a conventional active alignment method, an optical fiber is aligned with one end of an optical waveguide device. In this a beam emitted from a light source is incident to the other end of the optical waveguide device so that it passes through the optical fiber. A measurement is then conducted to measure the power of the light beam emerging from the optical fiber. Based on the result of the measurement, the alignment of the optical fiber with the optical waveguide device is adjusted. After completion of the alignment, the optical fiber is bonded to the optical waveguide device using epoxy.
In order to conduct the above mentioned method, in which an optical fiber is aligned with and then coupled to an optical waveguide device, however, it is necessary to use expensive equipment requiring a very high accuracy. Furthermore, a lengthy process time is required because of careful and difficult manual tasks required in the above mentioned alignment and coupling. In addition, there is a disadvantage in that it is difficult to separate the coupled optical fiber from the optical waveguide device because the optical fiber is bonded to the optical waveguide device using epoxy.
Additional examples of apparatus and methods for connecting or coupling optical fiber arrays and waveguides are seen in the following U.S. Patents. U.S. Pat. No. 5,177,804, to Shimizu et al., entitled Waveguide-Type Optical Switch, describes a planar waveguide-type optical switch with three bases, the bases being aligned with each other using fitting pins passing through pin holes in the bases.
U.S. Pat. No. 5,367,593, to Lebby et al., entitled Optical/Electrical Connector And Method of Fabrication, describes an optical/electrical connector in which one package has ferrules engaged in holes in a base which joins with the package.
U.S. Pat. No. 5,371,820, to Welbourn et al., entitled Optical Hybrid Motherboard Interconnection System And Method Of Assembling Same, describes a hybrid optical motherboard in which metal pins in grooves of a submount of a connector are used to align the connector with another connector.
U.S. Pat. No. 5,390,267, to Yanagawa et al., entitled Optical Fiber/Terminal Connecting Device, describes an optical connecting device in which positioning pins inserted into positioning pin holes are used to align different optical connectors.
U.S. Pat. No. 5,583,958, to Yanagawa et al., entitled Composite Optical Device, describes a composite optical device having two chips which are connected using guide pins inserted into guide pin fitting holes formed from V-grooves in opposing faces of two plates making up the chip.
U.S. Pat. No. 5,596,662, to Boscher, entitled Multichannel Optical Connection Method for Optical Fibers, describes a multichannel optical connection process in which two assemblies are joined using pegs.
U.S. Pat. No. 5,706,378, to Suzuki et al., entitled Method Of Production Of Optical Waveguide Module, describes an optical waveguide chip assembly in which positioning grooves and guide pins are used to align the modules of the assembly.
U.S. Pat. No. 5,818,990, to Steijer et al., entitled Encapsulation Of Optoelectronic Components, describes an optoelectronic component with guide grooves and guide pins for connecting to another optocomponent.
However, these apparatus may suffer from problems associated with adhesive penetrating into the recesses where the alignment pins are inserted, leading to loss of accuracy of the alignment.
SUMMARY OF THE INVENTION
It is therefore an object of the invention to provide an improved optical waveguide device, and method of manufacturing the device.
Another object of the invention is to provide an optical waveguide device which can be connected to an optical fiber array connector without use of active alignment equipment.
A further object of the present invention is to provide an optical waveguide device allowing easy connection to an optical fiber array connector.
A yet further object of the present invention is to provide an optical waveguide device allowing easy separation from the optical fiber array connector.
A still further object of the invention is to allow coupling of an optical waveguide device to an optical fiber array connector without epoxy.
In accordance with these objects, the present invention provides an optical waveguide device configured to be connected with an optical fiber array connector, the optical waveguide device comprising: an upper substrate and a lower substrate each being provided at a main surface thereof with at least two grooves each extending throughout the substrate in a direction corresponding to a coupling direction of the optical waveguide device to the optical fiber array connector, the upper and lower substrates being bonded to each other in such a fashion that the grooves of the upper substrate face those of the lower substrate, respectively; an optical waveguide portion formed at the main surface of one of the upper and lower substrates within a region defined between the grooves; tubes mounted between the facing grooves of the upper and lower substrates, respectively, each of the tubes having an insertion hole adapted to receive an alignment pin therein; and an adhesive adapted to bond the upper and lower substrates to each other and to bond the tubes to the upper and lower substrates.
In accordance with another aspect, the present invention provides a method for fabricating an optical waveguide device configured to be connected with an optical fiber array connector comprising the steps of: preparing two substrates; etching each of the substrates in such a fashion that the substrate is formed at a main surface thereof with at least two grooves each extending throughout the substrate in a direction corresponding to a coupling direction of the optical waveguide device to the optical fiber array connector; forming an optical waveguide portion at the main surface of one of the substrates within a region defined between the grooves; mounting, on one of the substrates, tubes each having an insertion hole adapted to receive an alignment pin therein in such a fashion that each of the tubes are partially received in an associated one of the grooves of the substrate while being partially protruded firm the associated groove; bonding the substrates to each other in such a fashion that the protruded portions of the tubes are received in respective grooves of the other substrate while bonding the tubes to the substrates; and grinding end surfaces of the resulting structure obtained after completion of the bonding step.
REFERENCES:
patent: 4973127 (1990-11-01), Cannon, Jr. et al.
patent: 5177804 (1993-01-01), Shimizu et al.
patent: 5367593 (1994-11-01), Lebby et al.
patent: 5371820 (1994-12-01), Welbourn et al.
patent: 5390267 (1995-02-01), Yanagawa et al.
patent: 5583958 (1996-12-01), Yanagawa et al.
patent: 5596662 (1997-01-01), Boscher
patent: 5706378 (1998-01-01), Suzuki et al.
patent: 5818990 (1998-10-01), Steijer et al.
patent: 5867620 (1999-02-01), Bunin et al.
patent: 0810456-A1 (1997-12-01), None
Lee et al., filed on Jan. 14, 2000, Ser. No. 09/482,534, entitled “Optical Fiber Array Connector And Method For Fabricating The Same”.
Lee Hyung-jae
Rhee Tae-hyung
Yoo Byong-Gwon
Bovernick Rodney
Bushnell , Esq. Robert E.
Samsung Electronics Co,. Ltd.
Stahl Michael J.
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