Optical switching apparatus and method of assembling same

Details Optical switching apparatus and method of assembling same Optical switching apparatus and method of assembling same

2005-09-06

2005-09-06

Mack, Ricky L. (Department: 2873)

Optical: systems and elements

Optical modulator

Light wave directional modulation

C359S290000, C359S291000

Reexamination Certificate

active

06940636

ABSTRACT:
In an optical switching apparatus having a mirror structure bonded to a substrate, the gap between the mirror structure and the substrate is controlled by mechanical standoffs placed between the mirror structure and the substrate. The mirror structure is bonded to the substrate using solder. The mechanical standoffs are formed from a material having a higher melting point than that of the solder. The mirror structure is bonded to the substrate under pressure at a temperature between the melting point of the solder and the melting point of the mechanical standoffs.

REFERENCES:
patent: 4786357 (1988-11-01), Campanelli et al.
patent: 4809901 (1989-03-01), Gen et al.
patent: 5173392 (1992-12-01), Miersch et al.
patent: 5323051 (1994-06-01), Adams et al.
patent: 5535526 (1996-07-01), White
patent: 5594979 (1997-01-01), Borchelt et al.
patent: 5604160 (1997-02-01), Warfield
patent: 5761350 (1998-06-01), Koh
patent: 5798557 (1998-08-01), Salatino et al.
patent: 5824177 (1998-10-01), Yoshihara et al.
patent: 5915168 (1999-06-01), Salatino et al.
patent: 6297072 (2001-10-01), Tilmans et al.
patent: 6327407 (2001-12-01), Mitsuda et al.
patent: 6373620 (2002-04-01), Wang
patent: 6516671 (2003-02-01), Romo et al.
patent: 6543286 (2003-04-01), Garverick et al.
patent: 6555417 (2003-04-01), Spooner et al.
patent: 6587626 (2003-07-01), Beguin et al.
patent: 6620642 (2003-09-01), Dudoff et al.
patent: 6706546 (2004-03-01), Yoshimura et al.
patent: 2002/0021055 (2002-02-01), Lee et al.
patent: 2002/0027294 (2002-03-01), Neuhaus et al.
patent: 2002/0045030 (2002-04-01), Ozin et al.
patent: 2002/0054422 (2002-05-01), Carr et al.
patent: 2002/0088988 (2002-07-01), Silverbrook
patent: 2002/0090180 (2002-07-01), Silverbrook
patent: 2002/0109894 (2002-08-01), Clark et al.
patent: 2003/0053233 (2003-03-01), Felton
patent: 2003/0092229 (2003-05-01), Silverbrook
patent: 2003/0113067 (2003-06-01), Koh et al.
patent: 2003/0119278 (2003-06-01), McKinnell
patent: 2001144117 (2001-05-01), None
patent: 2001269900 (2001-10-01), None
Smith et al., Micromachined Packaging for Chemical Microsensors, IEEE Trans, Electron Devices, Jun. 1988, vol. 35, No. 6, pp. 192-197.
Petersen et al., Silicon Fusion Bonding for Pressure Sensors, Rec. of the IEEE Solid-State Sensor and Actuator Workshop, 1988, pp. 209-212.
Rudolf et al., Silicon Microaccelerometer, Transducers' 87, Rec. of the 4thInt. Conf. on Solid-State Sensors and Actuators, 1987, pp. 376-379.
Ko et al., Bonding Techniques for Microsensors, Micromachining and Micropackaging of Transducers, 1985, pp. 198-208.
Roylance et al., A Batch-Fabricated Silicon Accelerometer, IEEE Trans. Electron Devices, Dec. 1979, vol. ED-26, No. 12, pp. 352-358.
Yoshio Awatani et al., Damage Free Dicing Method for MEMS Devices, International Conference on Opical MEMs Conference Digest, pp. 137-138, Aug. 20-23, 2002.
Lee et al., Fabrication of Silicon Optical Scanner for Laser Display; 2000, pp. 13-14.

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