Optical surface mount technology package

Details Optical surface mount technology package Optical surface mount technology package

2006-06-20

2006-06-20

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

C438S116000

Reexamination Certificate

active

07064424

ABSTRACT:
A semiconductor package includes a package substrate, an optical device die atop the package substrate, a transparent optical element atop the die, an optional dam around the die, and an encapsulant entirely covering the die and partially covering the transparent optical element.

REFERENCES:
patent: 2005/0009239 (2005-01-01), Wolff et al.

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