Optical sensor assemblage and corresponding manufacturing...

Details Optical sensor assemblage and corresponding manufacturing... Optical sensor assemblage and corresponding manufacturing...

2004-05-15

2010-12-21

Nguyen, Cuong Q (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S440000, C257S432000, C257S666000

Reexamination Certificate

active

07855426

ABSTRACT:
An optical sensor assemblage, in particular a thermopile sensor assemblage, comprising a sensor chip assemblage having an optically transparent irradiation region, a mounting region surrounding the latter, and a wire-bond region; an optically isolating mounting frame having a chip receiving region and a plurality of connector elements; and an optically isolating packaging device; the sensor chip assemblage being joined in the mounting region to the chip receiving region, and in the wire-bond region to one or more of the connector elements, the chip receiving region having a window disposed in such a way that at least a portion of the optical irradiation region is not covered by the chip receiving region; and the packaging device surrounding the sensor chip assemblage and the mounting frame in such a way that optical radiation can enter the sensor chip assemblage substantially only through the window.

REFERENCES:
patent: 6674159 (2004-01-01), Peterson et al.
patent: 6844606 (2005-01-01), Logsdon et al.
patent: 2002/0139410 (2002-10-01), Wilner et al.
patent: 1 211 721 (2002-06-01), None
patent: 2702095 (1996-02-01), None
patent: 2006-187919 (2006-07-01), None
patent: 03 067 657 (2003-08-01), None

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