Optical package structure

Details Optical package structure Optical package structure

2002-07-18

2004-09-07

Lee, Eddie (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

C257S080000, C257S081000, C257S082000, C257S098000, C257S099000

Reexamination Certificate

active

06787890

ABSTRACT:

FIELD OF THE INVENTION
The present invention generally relates to optical packages, and particularly to optical package structures adapted for high density packaging and high frequency transmission.
BACKGROUND OF THE INVENTION
Optoelectronic components generally require a package structure to protect them from damage and from EMI (Electro Magnetic Interference). Without such protection, damage can result from exposure to moisture, dirt, heat, radiation, or other hazards. In addition, a special structure is desired to electrically connect active components in a package with outer circuitry or other components if the active components need to be electrically connected therewith.
A traditional package structure, shown in
FIG. 5
, is disclosed in U.S. Pat. No. 5,812,582. The package structure
1
includes a header assembly
17
with a base
10
, and a cover assembly
18
having a cover
12
and a lens
13
. The two assemblies
17
and
18
are assembled together to define a closed space to receive and protect laser components
16
. The laser components
16
are mounted on a surface
101
of the base
10
and a plurality of electrical pins
11
extends through the base
10
via corresponding passages
19
and are electrically isolated from the base
10
by corresponding glass seals
15
. The laser components
16
are electrically connected with the corresponding electrical pins
11
by wires
14
. Thus, an external electrical connection of the laser components
16
is formed.
The above-mentioned package structure can satisfy a general need for packaging. However, the external electrical connection of the laser components
16
is formed by the electrical pins
11
and wires
14
, and the electrical pins
11
and wires
14
are long enough to produce capacitance and inductance strong enough to influence the working character of optical components during high frequency transmission. In addition, in high-density packaging, inner components need more electrical pins and wires to electrically connect with outer components, so packaging volume becomes larger and the short circuits become more frequent.
Therefore, an improved optical package structure that overcomes the above-mentioned disadvantages is desired.
SUMMARY OF THE INVENTION
A main object of the present invention is to provide an optical package structure adapted for high density packaging and high frequency transmission.
To achieve the above object, an optical package structure includes a cover with a lens part, and a base member attachable to the cover, together defining a closed space in which to package optical components. The base member has a bottom panel with the optical components mounted thereon, and a substrate. The bottom panel has a top surface with a plurality of solder pads thereon, and a plurality of inner conductive traces extending therethrough and electrically connecting with the solder pads. The solder pads electrically connect with the optical components. The substrate has a top surface with printed circuits thereon, a bottom surface with a plurality of solder pads thereon, and a plurality of inner conductive traces extending through the substrate and electrically connecting with the printed circuits and the solder pads. When the bottom panel is assembled to the substrate, the conductive traces of the bottom panel electrically connect with the printed circuits, so the solder pads of the bottom panel electrically connect with the solder pads of the substrate. Thus, an external electrical connection of the optical components is attained without wires and electrical pins.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description of a preferred embodiment thereof when taken in conjunction with the accompanying drawings, wherein:


REFERENCES:
patent: 4650285 (1987-03-01), Stevenson
patent: 5703394 (1997-12-01), Wei et al.
patent: 5932875 (1999-08-01), Chung et al.
patent: 5950074 (1999-09-01), Glenn et al.
patent: 5981945 (1999-11-01), Spaeth et al.
patent: 6130448 (2000-10-01), Bauer et al.

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