Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
Reexamination Certificate
2007-01-23
2007-01-23
Song, Sarah (Department: 2874)
Optical waveguides
With disengagable mechanical connector
Optical fiber to a nonfiber optical device connector
C385S088000
Reexamination Certificate
active
10787086
ABSTRACT:
An optical module for an optical device and an optical fiber is constituted by a pre-molded plastic package. In forming the plastic package, the main flowing direction of the molding resin is substantially parallel with the optical axis of the optical fiber. The optical module is formed by molding the resin by injection using pressure and then solidifying the resin. When the plastic package is formed by comprehensive molding, the flowing direction of the resin is parallel with the optical axis direction of the optical fiber to be installed in the optical module. As a result, for comprehensive molding, the molding pressure applied to the optical fiber is reduced. By using the resin case that is formed, the resulting package exhibits high rigidity and low thermal expansion properties in connection with the flowing direction of the resin, thus reducing the external stress and thermal stress applied to the optical fiber.
REFERENCES:
patent: 4410469 (1983-10-01), Katagiri et al.
patent: 4466009 (1984-08-01), Konishi et al.
patent: 4756592 (1988-07-01), Sasayama et al.
patent: 4897711 (1990-01-01), Blonder et al.
patent: 5013495 (1991-05-01), Noba et al.
patent: 5048919 (1991-09-01), Ladany
patent: 5481632 (1996-01-01), Hirai et al.
patent: 5684903 (1997-11-01), Kyomasu et al.
patent: 5727105 (1998-03-01), Nagata et al.
patent: 5737467 (1998-04-01), Kato et al.
patent: 5852696 (1998-12-01), Collins et al.
patent: 6170996 (2001-01-01), Miura et al.
patent: 6220764 (2001-04-01), Kato et al.
patent: 6282350 (2001-08-01), Takahashi et al.
patent: 6282352 (2001-08-01), Kato et al.
patent: 6312165 (2001-11-01), Yeandle et al.
patent: 6457877 (2002-10-01), Kato et al.
patent: 6632027 (2003-10-01), Yoshida et al.
patent: 313956 (1989-05-01), None
patent: 1-304405 (1989-12-01), None
patent: 2-271308 (1990-11-01), None
patent: 3-17605 (1991-01-01), None
patent: 04-212110 (1992-08-01), None
patent: 7-35954 (1995-02-01), None
patent: 7-321407 (1995-12-01), None
patent: 8-15576 (1996-01-01), None
patent: 8-248274 (1996-09-01), None
Robertson, Michael J., et al, “The Expanded Mode Laser-A Route to Low Cost Optoelectronics,” IEICE Trans. Electron, vol. E80-C, No. 1, Jan. 1997, pp. 17-23.
Collins, J.V., et al, “Laser Diode Chip and Packaging Technology,” Proceedings, SPIE, vol. 2610, pp. 108-116, Jan. 1996.
Hall, I.P., “Novel Techniques for Low-Cost, High Performance Optoelectronic Component Assembly,” 9th European Hybrid Microelectronics Conference, Nice, France, Jun. 1993, pp. 44-47.
Hall, I.P., “Non-hermetic Encapsulation and Assembly Techniques for Optoelectronic Applications,” 10th European Microelectronics Conference, May 14-17, 1995, Copenhagen, Denmark.
Proceedings of the Conference of the Institute of Electronics, Information and Communication Engineers, 1996, vol. 1, SC-3-14, pp. 478-479.
Proceedings of the Conference of the Institute of Electronics, Information and Communication Engineers, 1996, vol. 1, C-216, p. 216.
Proceedings of the Conference of the Institute of Electronics, Information and Communication Engineers, 1996, vol. 1, C-207, p. 207.
Fukuda Kazuyuki
Hirataka Toshinori
Ishii Toshiaki
Ishikawa Tadaaki
Kato Takeshil
Hitachi , Ltd.
Mattingly ,Stanger ,Malur & Brundidge, P.C.
Song Sarah
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