Optical force sensor for high density planar electrical intercon

Measuring and testing – Specimen stress or strain – or testing by stress or strain... – By loading of specimen

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356 33, 356 34, G01L 124

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054109175

ABSTRACT:
The present invention is a method and an apparatus for the precise quantitative measurement of the magnitude of force exerted at the points of contact on a high density electrical interconnect that quantitatively determines the magnitude of the force. The invention includes the steps of establishing a pressing relationship between a photoelastic material and the high density interconnect, coupling plane-polarized light into the photoelastic material stressed as a result of the pressing relationship with the high density interconnect, coupling of the polarized light being at 45 degrees with the direction of pressing, capturing an image of the fringe pattern of the plane polarized light exiting the stressed photoelastic material, the fringe pattern comprising of fringes wherein the number of fringes varies with the magnitude of the pressing force, and counting the number of fringes produced to determine the magnitude of force exerted on the photoelastic member.

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