Optical emission end point detector

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156627, 156643, 156646, 204192E, 204298, 356437, 356222, C23F 100, B44C 122, C03C 1500, C03C 2506

Patent

active

044914997

ABSTRACT:
A method for determining the optimum time at which a plasma etching operation should be terminated. The optical emission intensity (S.sub.1) of the plasma in a narrow band centered about a predetermined spectral line, indicative of the gas phase concentration of a plasma etch product or reactant species. The optical emission intensity (S.sub.2) of the plasma in a wide band centered about the predetermined spectral line, indicative of a background emission signal is also monitored. The intensity (S.sub.1L) of the spectral line is then determined in accordance with the equation S.sub.1L =S.sub.1 -k (.alpha.S.sub.2 -S.sub.1). The etching process is terminated when the monitored signal intensity (S.sub.1L) or its time derivative reaches a predetermined value.

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