Optical curing process for intergrated circuit package assembly

Details Optical curing process for intergrated circuit package assembly Optical curing process for intergrated circuit package assembly

1997-05-02

1998-12-08

Crispino, Richard

Plastic and nonmetallic article shaping or treating: processes

Direct application of electrical or wave energy to work

Infrared radiation

264494, 26427211, 26427217, B29C 3508

Patent

active

058464760

ABSTRACT:
In semiconductor device assembly operations, the use of an optical heat source 28, such as a tungsten halogen lamp module, is to replace ovens and heater blocks for curing die-attach material and molding compound with reduction in cycle time, cost, footprint, and contamination.

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