Optical component package

Details Optical component package Optical component package

1996-10-04

1998-11-24

Ostrowski, David

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

257 99, 257458, 257680, 257779, 361806, 361820, H01L 310203

Patent

active

058411780

ABSTRACT:
Disclosed is an optical package which is economical to manufacture. An optical component, such as a PIN photodiode, is bonded to a substrate such as silicon with no metallization on its side surfaces. The resulting assembly is solder bonded to the bottom surface of the package so that a side surface of the substrate is adjacent to the bottom surface with essentially no solder therebetween.

REFERENCES:
patent: 5011256 (1991-04-01), Johnson et al.
patent: 5132532 (1992-07-01), Watanabe
patent: 5239198 (1993-08-01), Lin et al.
patent: 5424573 (1995-06-01), Kato et al.

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