Optical clock signal distribution using through-silicon vias

Details Optical clock signal distribution using through-silicon vias Optical clock signal distribution using through-silicon vias

2011-08-23

2011-08-23

Hahm, Sarah (Department: 2874)

Optical waveguides

Integrated optical circuit

Reexamination Certificate

active

08005326

ABSTRACT:
An integrated circuit structure includes a semiconductor chip including a front surface and a back surface; a via extending from the back surface of the semiconductor chip into the semiconductor chip, wherein the via is light transparent; and a photon detector in the semiconductor chip and exposed to the via.

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Yang, M., et al., “A High-Speed, High-Sensitivity Silicon Lateral Trench Photodetector,” IEEE Electron Device Letters, vol. 23, No. 7, Jul. 2002, pp. 395-397.

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