Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1996-06-05
1998-04-21
Baxter, Janet C.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430170, 4302801, 4302851, 430311, G03C 1725, G03C 173, G03C 500
Patent
active
057416222
ABSTRACT:
A one-package type photosolder resist developable with an aqueous alkali solution and suitable for use as a solder resist for a printed circuit board is disclosed. The composition comprises (A) a copolymeric macromolecular compound containing at least one free carboxyl group in the molecular unit thereof or (A') a copolymeric macromolecular compound containing at least one free carboxyl group and at least one photoreactive unsaturated group in the molecular unit thereof and assuming a solid state at normal room temperature, (B) a diluent including a polyfunctional unsaturated compound assuming a liquid state at normal room temperature and/or an organic solvent, (C) a photopolymerization initiator, (D) a vinyltriazine compound or a derivative thereof, and (E) an inorganic filler. A process for forming a solder resist on a printed circuit board having a circuit preparatorily formed thereon comprises the steps of applying to the surface of said printed circuit board the one-package type photosolder resist composition mentioned above, drying the applied layer of said composition, selectively exposing the dried layer to actinic radiation according to a prescribed pattern, developing the unexposed area of said layer with an aqueous alkali solution thereby forming a solder resist pattern, and finally curing said resist pattern by exposure to actinic radiation.
REFERENCES:
patent: 3825430 (1974-07-01), Kurka
patent: 4304923 (1981-12-01), Rousseau
patent: 4544622 (1985-10-01), Kausch
patent: 4826753 (1989-05-01), Higashi et al.
patent: 4925773 (1990-05-01), Miyamura et al.
patent: 5009982 (1991-04-01), Kamayachi et al.
patent: 5055378 (1991-10-01), Miyamura et al.
patent: 5153102 (1992-10-01), Lee et al.
patent: 5268255 (1993-12-01), Kikuchi et al.
Ashton Rosemary
Baxter Janet C.
Kananen Ronald P.
Taiyo Ink Manufacturing Co., Ltd.
LandOfFree
One-package photosolder resist composition developable with aque does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with One-package photosolder resist composition developable with aque, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and One-package photosolder resist composition developable with aque will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2056459