Chemistry: electrical and wave energy – Processes and products
Patent
1978-01-30
1979-01-23
Lanham, C. W.
Chemistry: electrical and wave energy
Processes and products
427 97, 427 98, 174 685, 29625, C25D 502, H05K 306
Patent
active
041359887
ABSTRACT:
A process for manufacturing printed circuit boards having plated through-holes. An epoxy glass substrate is laminated on opposite surfaces by a thin copper foil and subsequently apertures are drilled through the laminated substrate where the plated through-holes are desired. The exposed surfaces of the apertures are electroless copper plated. Then by means of a photoresist, the desired circuit images and the apertures are exposed and the initial electroless copper plating is removed again. The apertures and the desired circuit images are again plated by electroless copper plating to establish an initial copper thickness. The apertures in the desired circuit images are then electro-copper plated to the approximate thickness of the photoresist and preferably so that their thickness is less than the thickness of the photoresist. The copper plating is then electro-solder plated. The remaining photoresist is removed and the now exposed laminated copper foil is chemically removed to provide the finished printed circuit board.
REFERENCES:
patent: 3457638 (1969-07-01), Johnson
patent: 3606677 (1971-09-01), Ryan
patent: 3673680 (1972-07-01), Tanaka et al.
patent: 3855692 (1974-12-01), Dugan
patent: 4088545 (1978-05-01), Supnet
Dugan William P.
Muhr John A.
Bissell Henry M.
Crane Daniel C.
General Dynamics Corporation
Johnson Edward B.
Lanham C. W.
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