Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Field effect device in non-single crystal – or...
Patent
1992-11-30
1995-04-04
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Non-single crystal, or recrystallized, semiconductor...
Field effect device in non-single crystal, or...
257 69, 257369, 257903, H01L 2711, H01L 2978
Patent
active
054040302
ABSTRACT:
An improved static random access memory device of the CMOS load memory cell type for storing one-bit information is capable of 4M bit or greater memory capacity. Each memory cell includes two transfer transistors, two driving transistors, and two load transistor elements. Each load transistor element is a PMOS thin film transistor and comprises a source formed of first and second conductive layers and connected to a constant power source line, and a drain also formed of the first and second conductive layers and connected to the drain of a corresponding one of the driving transistors. A channel region of each load transistor element is composed only along the region defined by the second conductive layer and a respective gate is formed of a third conductive layer which is separated from the channel region by a gate insulating layer.
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Furuta et al., "Hot-Carrier Induced Ion/Ioff Improvement of Offset PMOS TFT", NEC Corporation, pp. 27 and 28.
Uemoto et al., "A High-Performance Stacked-CMOS SRAM Cell by Solid Phase Growth Technique", 1990 Symposium on VLSI Technology, 1990 IEEE, pp. 21 and 22.
Ikeda et al., "A Polysilicon Transistor Technology for Large Capacity SRAMs", 1990 IEEE, pp. 18. 1.1-18. 1.4.
Jun Sung-bu
Kim Jhang-Rae
Donohoe Charles R.
Hille Rolf
Samsung Electronics Co,. Ltd.
Westerlund, Jr. Robert A.
Whitt Stephen R.
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