On-chip power-ground inductance modeling using effective...

Details On-chip power-ground inductance modeling using effective... On-chip power-ground inductance modeling using effective...

2005-12-27

2005-12-27

Do, Thuan (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000, C716S030000, C703S014000

Reexamination Certificate

active

06981230

ABSTRACT:
An efficient inductance modeling approach for on-chip power-ground wires using their effective self-loop-inductances is disclosed. Instead of extracting the inductive coupling between every two parallel wires and putting this huge number inductance elements into circuit simulation, this technique determines the effective self-loop-inductance for each power or ground wire segment and only generates a circuit with these effective self-inductors for simulation. This approach greatly reduces the circuit size and makes the full-chip power-ground simulation with the consideration of inductance feasible.

REFERENCES:
patent: 5326932 (1994-07-01), You
patent: 5694344 (1997-12-01), Yip et al.
patent: 6453444 (2002-09-01), Shepard
patent: 6523150 (2003-02-01), Buffet et al.
patent: 2002/0107647 (2002-08-01), Anderson et al.
patent: 2002/0163396 (2002-11-01), Lim et al.
Gala, Kaushik, et al.,On-Chip Inductance Modeling and Analysis, Annual ACM IEEE Design Automation Conference, Proceedings of the 37thconference on Design Automation, 2000, pp. 63-68, ACM Press, New York, NY, USA, ISBN: 1-58113-187-9.

Affiliated with

Also associated with

Rating

On-chip power-ground inductance modeling using effective... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with On-chip power-ground inductance modeling using effective..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and On-chip power-ground inductance modeling using effective... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3467538