Omission of thick Si.sub.3 N.sub.4 layers in ISA schemes

Details Omission of thick Si.sub.3 N.sub.4 layers in ISA schemes Omission of thick Si.sub.3 N.sub.4 layers in ISA schemes

1981-04-07

1982-06-08

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29571, 29580, 148175, 148187, 156643, 156653, 1566591, 156662, 357 43, H01L 21306, H01L 21312

Patent

active

043337945

ABSTRACT:
The present invention provides a process which comprises:

REFERENCES:
patent: 4135954 (1979-06-01), Chang et al.
patent: 4142926 (1979-03-01), Morgan
patent: 4209349 (1980-06-01), Ho et al.
patent: 4252579 (1981-02-01), Ho et al.

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