Offset integrated circuit package-on-package stacking system

Details Offset integrated circuit package-on-package stacking system Offset integrated circuit package-on-package stacking system

2006-05-15

2010-06-29

Norris, Jeremy C (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S260000

Reexamination Certificate

active

07746656

ABSTRACT:
An offset integrated circuit package-on-package stacking system is provided including providing a base substrate, providing an array of contact pads on the base substrate, mounting an active component and an optional passive component on the base substrate, injecting a mold cap on the base substrate, mounting an offset package on the base substrate and the mold cap, and singulating a package-on-package from the base substrate.

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