Nozzle structure of repair apparatus for semiconductor package

Details Nozzle structure of repair apparatus for semiconductor package Nozzle structure of repair apparatus for semiconductor package

1998-09-11

2000-08-22

Ryan, Patrick

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228 62, 228 495, B23K 100, B23K 500

Patent

active

061058475

ABSTRACT:
A nozzle structure of a repair apparatus for a semiconductor package includes a funnel holder connected to a repair apparatus, a cylinder extended downwardly from the funnel holder, a vacuum tube provided along an axis of the cylinder, a vacuum absorption body housing the vacuum tube therein, and a pair of exhaust guide wall clips. A lower portion of the cylinder is compressed from four sides thereof so as to form a rectangular ending thereof which has first through fourth side walls. The vacuum absorption body is positioned between the first and third side walls. Each of the exhaust side walls is fixed to corresponding side edge lines of the first and third side walls, wherein the first and third side walls are identical in height and facing each other, the second and fourth side walls are identical in height and facing each other, and the first and third side walls are shorter than the second and fourth side walls in height.

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