Coating processes – Immersion or partial immersion – Chemical compound reducing agent utilized
Patent
1993-03-29
1995-02-07
Niebling, John
Coating processes
Immersion or partial immersion
Chemical compound reducing agent utilized
205127, 347 45, G01D 1518
Patent
active
053874404
ABSTRACT:
The entire part of a rear surface 2 of a nozzle plate 1 excluding peripheral portions 6 of nozzle holes 4 is coated with a resist tape, and this nozzle plate 1 is immersed in an electrolytic solution in which ions of a metal and particles of a water-repellent resin are dispersed to provide a plating thereon, and the plated nozzle plate 1 in the electrolytic solution is then heated to a temperature that is higher than a melting point of the water-repellent resin, whereby an entire portion extending from a front surface 3 of the nozzle plate 1 and the nozzle holes 4 contiguous to the front surface to the rear surface 2 is provided with a eutectoid plating layer 8 to suppress deviation of the passage of ink droplets due to wetting by an ink or the like.
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European Patent Application 0 359 365 A1 to Tektronix, Inc. Mar. 21, 1990.
Kamijo Masanori
Kobayashi Takeshi
Takemoto Kiyohiko
Yamamori Akio
Yayaguchi Shuichi
Mee Brendan
Niebling John
Seiko Epson Corporation
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