Novel etching composition and method for using same

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156659, 156665, 156904, 252 792, 252 794, 427250, C23F 102

Patent

active

040802469

ABSTRACT:
An improved etchant solution for selectively etching unprotected areas of metal film from a substrate which comprises between about 65 and about 90 parts by weight phosphoric acid, between about 0.5 and about 5 parts by weight of a perchloric acid component and between about 9 and about 30 parts by weight water, which composition contains from 0 to about 5% by weight total volume of a neutral or anionic wetting agent. The invention also comprises the method of utilizing the etchant composition and the improved precision device produced thereby.

REFERENCES:
patent: 3202612 (1965-08-01), Nelson
patent: 3715250 (1973-02-01), Altman et al.
patent: 3833434 (1974-09-01), Kikuchi et al.
patent: 3905907 (1975-09-01), Shiga
patent: 3953263 (1976-04-01), Ishikawa et al.

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