Nonvolatile semiconductor memory device and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S296000, C257S301000, C257S302000, C257S303000, C257S330000, C257S405000, C257S406000, C257SE29170, C257SE29257, C257SE29309, C257SE27071, C257SE21210, C257SE21679, C438S243000, C438S259000, C438S261000, C438S270000, C438S386000, C438S589000, C438S591000

Reexamination Certificate

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08072024

ABSTRACT:
A nonvolatile semiconductor memory device with a substrate. A plurality of dielectric films and electrode films are alternately stacked on the substrate and have a through hole penetrating in the stacking direction. A semiconductor pillar is formed inside the through hole. A charge storage layer is provided at least between the semiconductor pillar and the electrode film. At least part of a side surface of a portion of the through hole located in the electrode film is sloped relative to the stacking direction.

REFERENCES:
patent: 2007/0158736 (2007-07-01), Arai et al.
patent: 2007/0252201 (2007-11-01), Kito et al.
patent: 2008/0048245 (2008-02-01), Kito et al.
patent: 2008/0067583 (2008-03-01), Kidoh et al.
patent: 2008/0157092 (2008-07-01), Arai et al.
patent: 2008/0173928 (2008-07-01), Arai et al.
patent: 2008/0173932 (2008-07-01), Kidoh et al.
patent: 2008/0217673 (2008-09-01), Maruyama et al.
patent: 2009/0184360 (2009-07-01), Jin et al.
patent: 2007-266143 (2007-10-01), None
U.S. Appl. No. 12/886,132, filed Sep. 20, 2010, Yahashi, et al.
U.S. Appl. No. 12/966,458, filed Dec. 13, 2010, Sakurai, et al.

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