Nonvolatile semiconductor memory device and manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S314000, C257S315000, C257S316000, C257SE29129

Reexamination Certificate

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07821057

ABSTRACT:
A nonvolatile semiconductor memory device includes a semiconductor substrate of a first conductivity type, a pair of source and drain diffusion regions of a second conductivity type oppositely formed on a surface of the semiconductor substrate, and a stacked structure having a gate insulating film, a charge accumulation film, an interlayer insulating film and a control gate which are formed in order on a channel region of the surface of the semiconductor substrate interposed between the source and drain diffusion regions. An edge of the stacked structure in the vicinity of the source region is formed away from a junction position between the source diffusion region and the channel region.

REFERENCES:
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patent: 2006/0267067 (2006-11-01), Ishihara
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N. Mohapatra et al., “Chisel Programming Operation of Scaled NOR Flash EEPROMs—Effect of Voltage Scaling, Device Scaling and Technological Parameters,” IEEE Transactions on Electron Devices, vol. 50, No. 10, pp. 2104-2111 (Oct. 2003).
Notification of Reasons for Rejection issued by the Japanese Patent Office on Nov. 4, 2008, for Japanese Patent Application No. 2006-183658, and English-language translation thereof.
Final Notice of Rejection mailed by the Japanese Patent Office on Jan. 27, 2009, for Japanese Patent Application No. 2006-183658, and English language translation thereof.

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