Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate
2008-04-24
2011-11-22
Fulk, Steven (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Having insulated electrode
C257SE29309
Reexamination Certificate
active
08063433
ABSTRACT:
A memory cell includes an ONO film composed of a stacked film of a silicon nitride film SIN which is a charge trapping portion and oxide films BOTOX and TOPOX positioned under and over the silicon nitride film, a memory gate electrode MG over the ONO film, a source region MS, and a drain region MD, and program or erase is performed by hot carrier injection in the memory cell. In the memory cell, a total concentration of N—H bonds and Si—H bonds contained in the silicon nitride film SIN is made to be 5×1020cm−3or less.
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Aoki Yasunobu
Ishimaru Tetsuya
Mine Toshiyuki
Shimamoto Yasuhiro
Toba Koichi
Fulk Steven
Miles & Stockbridge P.C.
Renesas Electronics Corporation
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