Nonvolatile memory and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S057000, C257S059000, C257S314000, C257S315000, C257S316000, C257S317000, C257S344000, C257S345000, C257S346000, C257S763000, C438S209000, C438S211000, C438S257000, C438S266000

Reexamination Certificate

active

07078769

ABSTRACT:
Memory elements, switching elements, and peripheral circuits to constitute a nonvolatile memory are integrally formed on a substrate by using TFTs. Since semiconductor active layers of memory element TFTs are thinner than those of other TFTs, impact ionization easily occurs in channel regions of the memory element TFTs. This enables low-voltage write/erase operations to be performed on the memory elements, and hence the memory elements are less prone to deteriorate. Therefore, a nonvolatile memory capable of miniaturization can be provided.

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