Noncontact ID card and method of manufacturing the same

Details Noncontact ID card and method of manufacturing the same Noncontact ID card and method of manufacturing the same

2005-04-19

2005-04-19

Vigushin, John B. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S768000, C361S771000, C361S782000

Reexamination Certificate

active

06882545

ABSTRACT:
A noncontact ID card composed by laminating an antenna circuit board where an antenna is formed and an interposer board formed by connecting an enlarged electrode to an electrode of a mounted IC chip and bonding between an antenna electrode of the antenna circuit board and the enlarged electrode of the interposer board with electroconductive adhesive material, wherein a substrate of the antenna circuit board and a substrate of the interposer board are bonded. In addition, in another composition, at least one local deformation is applied to a boding face of the electrodes each other in a direction crossing the bonding face.

REFERENCES:
patent: 5606488 (1997-02-01), Gustafson
patent: 5640306 (1997-06-01), Gaumet et al.
patent: 6310778 (2001-10-01), Finn et al.
patent: 6380614 (2002-04-01), Higuchi et al.
patent: 6816380 (2004-11-01), Credelle et al.
patent: WO-0162517 (2001-08-01), None

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