Non-volatile semiconductor memory device having reduced current

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257316, 257324, H01L 2968

Patent

active

055920020

ABSTRACT:
In a non-volatile semiconductor memory device, an n-type impurity diffusion layer constituting source and drain regions is formed on the surface area of a p-type silicon substrate, and then a first oxide film is formed on the n-type impurity diffusion layer. A floating gate is formed on the silicon substrate so as to be partially overlapped with the drain region through a second oxide film, and a control gate is formed thereon through a third oxide film and an insulating film. The thickness of the third oxide film is set to a value larger than the total thickness of the second oxide film and the insulating film to prevent occurrence of F-N tunnel action in a split gate region.

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Gheorghe Samachisa et al, "A 128K Flash EEPROM Using Double-Polysilicon Technology", IEEE J. Solid-State Circuits, vol. SC-22, No. 5, pp. 176-182. No date.

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