Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region
Reexamination Certificate
2007-02-13
2007-02-13
Brewster, William M. (Department: 2823)
Semiconductor device manufacturing: process
Introduction of conductivity modifying dopant into...
Ion implantation of dopant into semiconductor region
C438S535000, C438S550000, C438S714000
Reexamination Certificate
active
11112643
ABSTRACT:
A method of non-thermal annealing of a silicon wafer comprising irradiating a doped silicon wafer with electromagnetic radiation in a wavelength or frequency range coinciding with lattice phonon frequencies of the doped semiconductor material. The wafer is annealed in an apparatus including a cavity and a radiation source of a wavelength ranging from 10–25 μm and more particularly 15–18 μm, or a frequency ranging from 12–30 THz and more particularly 16.5–20 THz.
REFERENCES:
patent: 4303455 (1981-12-01), Splinter et al.
patent: 4474625 (1984-10-01), Cohen et al.
patent: 5626670 (1997-05-01), Varshney et al.
patent: 5851319 (1998-12-01), Atwater et al.
patent: 5917195 (1999-06-01), Brown
patent: 6001715 (1999-12-01), Manka et al.
patent: 6316123 (2001-11-01), Lee et al.
patent: 2004/0087118 (2004-05-01), Maegawa et al.
Lojek Bohumil
Whiteman Michael D.
Atmel Corporation
Brewster William M.
Schneck Thomas
Schneck & Schneck
LandOfFree
Non-thermal annealing with electromagnetic radiation in the... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Non-thermal annealing with electromagnetic radiation in the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Non-thermal annealing with electromagnetic radiation in the... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3874684