Non-thermal annealing with electromagnetic radiation in the...

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region

Reexamination Certificate

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C438S535000, C438S550000, C438S714000

Reexamination Certificate

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11112643

ABSTRACT:
A method of non-thermal annealing of a silicon wafer comprising irradiating a doped silicon wafer with electromagnetic radiation in a wavelength or frequency range coinciding with lattice phonon frequencies of the doped semiconductor material. The wafer is annealed in an apparatus including a cavity and a radiation source of a wavelength ranging from 10–25 μm and more particularly 15–18 μm, or a frequency ranging from 12–30 THz and more particularly 16.5–20 THz.

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patent: 2004/0087118 (2004-05-01), Maegawa et al.

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