Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2006-08-29
2006-08-29
Patel, Ishwar I. B. (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S255000
Reexamination Certificate
active
07098407
ABSTRACT:
In one embodiment, a pad is formed on a substrate surface. The pad is connected with a connecting pattern. A first mask is formed on the substrate. The first mask has a first opening exposing at least a portion of the pad and a portion of the connecting pattern. A second mask is formed on the first mask. The second mask has a second opening exposing at least a portion of the pad and a portion of the connecting pattern. A boundary surface or sidewall of the first opening is not coplanar with a boundary surface or sidewall of the second opening. Therefore, stresses may be prevented from concentrating on the boundary surface of the first opening, thereby allowing dispersion of the stresses and restraining pattern cracks.
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English language abstract of Korea Publication No. 1020010113450.
English language abstract of Korea Publication No. 2002-0059851.
English language abstract of Korea Publication No. 2002-0087975.
English language abstract of Japanese Publication No. 2001-298117.
English language abstract of Japanese Publication No. 2000-277898.
English language abstract of Korean Publication No. 2002-0016125.
English language abstract of Korean Publication No. 2002-0024621.
Choi Hee-Kook
Kang In-Ku
Kim Jin-Ho
Marger & Johnson & McCollom, P.C.
Patel Ishwar (I. B).
Samsung Electronics Co,. Ltd.
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