Non-metallurgical connection between an integrated circuit and a

Details Non-metallurgical connection between an integrated circuit and a Non-metallurgical connection between an integrated circuit and a

1996-09-27

1998-11-10

Chaudhuri, Ollk

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438108, 438109, H01L 2144

Patent

active

058343350

ABSTRACT:
A method is disclosed for making a non-metallurgical connection between an integrated circuit (16) and either a circuit board (12) or second integrated circuit. In one embodiment, an electrical connection is formed between terminals (28) of an integrated circuit (16) and pads (20) on a circuit board (12) without metallurgically connecting the terminals (28) and pads (20). The integrated circuit (16) can be in either packaged or die form. A clamping mechanism (18, 36) attached to the circuit board (12) clamps the integrated circuit (16) to the circuit board (12).

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