Optics: measuring and testing – Dimension – Width or diameter
Reexamination Certificate
2006-06-20
2006-06-20
Toatley, Jr., Gregory J. (Department: 2877)
Optics: measuring and testing
Dimension
Width or diameter
C356S601000
Reexamination Certificate
active
07064846
ABSTRACT:
The present invention relates generally to photolithographic systems and methods, and more particularly to systems and methodologies that facilitate the reduction of line-edge roughness (LER) and/or standing wave expression during pattern line formation in an integrated circuit. Systems and methods are disclosed for retaining a target critical dimension (CD) of photoresist lines, comprising a non-lithographic shrink component that facilitates mitigating LER and/or standing wave expression, wherein the shrink component is employed to heat a particular resist to the glass transition temperature of the resist to effectuate mitigation of LER and/or standing wave expression. Additionally, by heating the resist to its glass transition temperature, the systems and methods of the present invention effectively impede deviation from a desired target critical dimension.
REFERENCES:
patent: 6506665 (2003-01-01), Sato
patent: 6516528 (2003-02-01), Choo et al.
patent: 6570157 (2003-05-01), Singh et al.
patent: 6582891 (2003-06-01), Hallock et al.
patent: 6709807 (2004-03-01), Hallock et al.
patent: 6905949 (2005-06-01), Arita
patent: 2004/0038549 (2004-02-01), Arita
Amblard Gilles
Phan Khoi A.
Singh Bhanwar
Subramanian Ramkumar
Advanced Micro Devices , Inc.
Amin & Turocy LLP
Punnoose Roy M.
Toatley , Jr. Gregory J.
LandOfFree
Non-lithographic shrink techniques for improving line edge... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Non-lithographic shrink techniques for improving line edge..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Non-lithographic shrink techniques for improving line edge... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3650329