Non-linear circuit elements on integrated circuits

Details Non-linear circuit elements on integrated circuits Non-linear circuit elements on integrated circuits

1998-05-05

2000-05-23

Bowers, Charles

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438627, 438643, 438639, H01L 214763

Patent

active

060665602

ABSTRACT:
An electrical interconnection structure on an integrated circuit is provided that has a) a substrate layer; b) a diffusion barrier on the substrate layer; c) a copper layer on the diffusion barrier; and d) a copper oxide layer on the copper layer. Methods of making such an interconnection structure is also provided. Such an interconnection structure may be used as a rectifier to prevent damage of sensitive devices from voltage spikes.

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Gwynne, Peter, "Back To The Future: Copper Comes of Age", IBM Research, No. 4, 1997, pp. 17-21.
"Solid state", Technology 1998 Analysis & Forecast, IEEE Spectrum, Jan. 1998, pp. 23-24.
Ramo, Joshua C., "Chips Ahoy", Time, Oct. 6, 1997, p. 72.

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