Non-leaded integrated circuit package system with multiple...

Details Non-leaded integrated circuit package system with multiple... Non-leaded integrated circuit package system with multiple...

2011-08-23

2011-08-23

Dickey, Thomas L (Department: 2826)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257SE23037

Reexamination Certificate

active

08003443

ABSTRACT:
A non-leaded integrated circuit package system is provided providing a die paddle of a lead frame, forming a dual row of terminals including an outer terminal and an inner terminal, and selectively fusing an inner terminal and an adjacent inner terminal to form a fused lead.

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