Non-etched high power HTS circuits and method of...

Superconductor technology: apparatus – material – process – High temperature devices – systems – apparatus – com- ponents,... – High frequency waveguides – resonators – electrical networks,...

Reexamination Certificate

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Details

C505S700000, C505S866000, C333S09900R, C333S204000, C333S219000

Reexamination Certificate

active

06263220

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to a high power superconductive circuit and to a method of constructing said circuit. More particularly, this invention relates to a circuit having a substrate with one or more grooves formed in said substrate for receiving one or more wafers that are arranged to function as microwave components of said circuit.
2. Description of the Prior Art
It is known to form high temperature superconductive circuits on a substrate using a thin film of ceramic material that becomes superconductive at cryogenic temperatures. Previous circuits are formed by affixing a high temperature superconductive thin film to the substrate and subsequently subjecting the thin film to etching. The etching can be chemical etching or dry etching. When chemical etching is used, the chemical eats away that part of the thin film that must be removed in order to form the desired circuit. A glass plate template is used to cover that portion of the thin film that is not subjected to etching. With dry etching, a milling machine is used to remove those parts of the thin film that must be removed in order to leave the desired circuit on the substrate. Both chemical etching and dry etching require a large time input and both forms of etching degrade the power handling capability of the resulting circuit significantly. The cost of fabricating HTS planar filters is considered extremely high in comparison to that of conventional microwave filters due to the cost of the lithographic process used to fabricate planar high temperature superconductive filters and the limited number of filters one can produce from one high temperature superconductive wafer. The use of lithographic fabrication processes has been known to reduce the power handling capability of high temperature superconductive filters.
SUMMARY OF THE INVENTION
It is an object of the present invention to produce a high power superconductive circuit that has high power handling capability compared to previous circuits and has resonators formed on a substrate without etching and without using lithographic fabrication processes. It is a further object of the present invention to increase the number of HTS circuits that can be produced from one HTS wafer and to produce HTS circuits at a relatively low cost compared to conventional HTS circuits.
A high power high temperature superconductive circuit is used for passing current having a substrate with a base and top. The base has a ground plane thereon and the circuit has an input and output. The top contains at least one groove and at least one corresponding wafer comprising high temperature superconductive material. The groove and wafer are sized and located so that one wafer is located in each groove with each wafer functioning as a microwave component when the current passes through the circuit. Preferably, each circuit has a plurality of grooves and corresponding wafers.
A method of constructing a high power high temperature superconductive circuit having a substrate with a base and a top, the base having a ground plane thereon, said method comprising the steps of forming at least one groove in the top, sizing and locating each groove to receive a corresponding wafer comprising high temperature superconductive material, shaping each wafer to fit within a corresponding groove, placing one wafer in each groove, affixing each wafer with a suitable adhesive, adding an input and an output to the circuit, the wafers being arranged in relation to the input and the output to function as resonators when the circuit is operational.


REFERENCES:
patent: 5334958 (1994-08-01), Babbitt et al.
patent: 5479139 (1995-12-01), Koscica et al.
patent: 5703020 (1997-12-01), Das

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