Non-destructure method of performing electrical burn-in testing

Details Non-destructure method of performing electrical burn-in testing Non-destructure method of performing electrical burn-in testing

1990-04-18

1991-04-16

Hall, Carl E.

Metal working

Method of mechanical manufacture

Electrical device making

29857, 228123, 2281802, 361406, 437180, H05K 334

Patent

active

050071637

ABSTRACT:
A method of nondestructively testing electronic chips adapted for direct attachment to metallized pads on circuitized substrate is disclosed, wherein an electrically conductive liquid eutectic joint is formed at room temperature with low pressure between electrical terminals on the chip and pads on the substrate. The eutectic joint remains liquid at test temperature, enabling test completion. At the end thereof, chips and pads are separated and any eutectic material residue thereon removed. The eutectic is preferably gallium/indium.

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