Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Patent
1997-10-21
2000-01-25
Ryan, Patrick
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
2281801, 22818021, 228104, 228105, 420563, 420565, 420570, H01L 2100
Patent
active
060169478
ABSTRACT:
A non-destructive method for identifying off-composition solder columns of for example, a ceramic column grid array. The method is performed at the ceramic module level prior to card assembly to avoid costly loss or rework post card assembly. The assembly of solder columns on a substrate is heated to a temperature below the melting temperature of pure-composition solder and above the temperature of attachment of a solder column to an organic board. Heating the assembly produces visually detectable changes characteristic of off-composition solder which are used for identifying which solder columns are composed of off-composition solder.
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S.O. Bowen et al., Guardbanding Card Assemblies Within The Manufacturing Line, IBM Technical Disclosure Bulletin, vol. 34 No. 7B, 343-4 (1991).
Brofman Peter J.
Donahue Timothy W.
Ingalls Ellyn M.
Lei Chon Cheong
Ma Wai Mon
Elve M. Alexandra
International Business Machines - Corporation
Ryan Patrick
Townsend Tiffany L.
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