Non-destructive laser optical integrated circuit package...

Details Non-destructive laser optical integrated circuit package... Non-destructive laser optical integrated circuit package...

2011-04-26

2011-04-26

Wyrozebski, Kat (Department: 1743)

Plastic and nonmetallic article shaping or treating: processes

Laser ablative shaping or piercing

C264S482000, C438S800000, C257SE23179

Reexamination Certificate

active

07931849

ABSTRACT:
A method is provided for laser optically marking integrated circuit (IC) packages in a non-destructive manner. The method provides an IC die encapsulated as a package in a compound of glass spheres and epoxy. An acute angle is defined between a laser optical path and an IC package planar surface. The IC package surface is scanned with a laser, and in response to ablating the IC package surface, a legible mark on the planar surface.

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