Non-destructive interconnect system for semiconductor devices

Details Non-destructive interconnect system for semiconductor devices Non-destructive interconnect system for semiconductor devices

1995-01-20

1995-11-21

Nguyen, Khiem

Electrical connectors

Coupling part with actuating means urging contact to move...

Contractile receptacle

439 73, 439526, H01R 1315

Patent

active

054681588

ABSTRACT:
An interconnect system (8') for providing electrical connection to bond pads on a semiconductor device (21) includes a socket (12) having a plurality of conductors (46) and a carrier assembly (40) mounted on the socket (12) for carrying a semiconductor device (21). The carrier assembly (40) includes a substrate (17) having a compliant membrane (20b) and a plurality of contact bumps (24) on a top surface of the compliant membrane (20b) for contacting bond pads on the semiconductor device (21) and a force applying mechanism (63). Compliant membrane (20b) is part of a thin film interconnect (20). Contact bumps (24) are connected electrically with conductors (46) by conductive traces (19) and contact pads (18) formed on the thin film interconnect (20). The force applying mechanism (63') applies pressure in making temporary electrical connection between contact bumps (24) and the bond pads of semiconductor device (21). The interconnection system (8') provides non-destructive interconnection to semiconductor device (21).

REFERENCES:
patent: 4684184 (1987-08-01), Grabbe et al.
patent: 4832612 (1989-05-01), Grabbe et al.
patent: 5127837 (1992-07-01), Shah et al.
patent: 5180976 (1993-01-01), Van Loan et al.

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