Method of manufacturing a circuit board

Details Method of manufacturing a circuit board Method of manufacturing a circuit board

1989-09-12

1991-02-19

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

361388, 174252, 174255, 174260, H05K 330

Patent

active

049931482

ABSTRACT:
A method is provided for forming a circuit board which comprises a copper plate and an insulating layer of photosensitive polyimide resin formed on the copper plate, the insulating layer leaving an exposed portion of a surface of the copper plate where an LSI is to be mounted. After Au plating is applied to the exposed surface of the copper plate, the LSI is mounted fixedly. A connection pattern having bonding pads is formed by copper plating on the insulating layer. The bonding pads and the LSI are connected by Au wire bonding on the Au plating applied on the bonding pads.

REFERENCES:
patent: 3793064 (1974-02-01), Budd et al.
patent: 4498121 (1985-02-01), Breedis et al.
patent: 4544989 (1985-10-01), Nakabu
patent: 4682414 (1987-07-01), Butt
patent: 4737395 (1988-04-01), Mabuchi et al.
patent: 4811166 (1989-03-01), Alvarez et al.
Electronic Materials: "Double-Sided Printed Circuit Board with Plated Through-Holes", by Takeshi Kano and Muhahiko Fukushima, Oct. 1986, pp. 72-77.

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