Non-cyanogen type electrolytic solution for plating gold

Details Non-cyanogen type electrolytic solution for plating gold Non-cyanogen type electrolytic solution for plating gold

2007-08-28

2007-08-28

Wilkins, III, Harry D. (Department: 1742)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal coating

C205S266000

Reexamination Certificate

active

10661533

ABSTRACT:
A non-cyanogen type electrolytic solution, for plating gold, contains a gold salt as a supply source of gold and is added with a non-cyanogen type compound wherein the electrolytic plating solution is added with one selected from a group of thiouracil; 2-aminoethanethiol; N-methylthiourea, 3-amino-5-mercapto-1,2,4-triazole; 4,6-dihydroxy-2-mercaptopyrimidine; and mercapto-nicotinate; as a compound forming a complexing compound with gold. Chloroaurate or gold sulfite is preferably used as a gold salt.

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“2-Aminoethanethiol”, from Chemfinder.com.
“Thiouracil”, from Chemfinder.com.
Schmid et al, “Metal Clusters and Colloids”, Advances Materials, vol. 10, No. 7, 1998 (no month), pp. 515-523.
Nomiya et al, “Synthesis and crystal structure of a hexanuclear silver (I) cluster . . . and a supramolecular gold(I) complex in the solid state, and their antimicrobial activities”, Journal of the Chemical Society, Dalton Transactions, 2000 (no month), pp. 2091-2097.
“2-Aminoethanethiol”, from Chemfinder.com, accessed May 2006.
“Thiouracil”, from Chemfinder.com, accessed May 2006.
Chinese Office Action for corresponding Chinese Patent Application No.: 031544401 dated Mar. 30, 2007.

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