Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate
2000-06-23
2002-04-30
Clark, Jhihan B. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
C257S787000, C257S492000, C257S380000, C257S451000, C361S737000
Reexamination Certificate
active
06380614
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a non-contact type IC card including a plane coil and a semiconductor element arranged at a position not overlapping with the plane coil, wherein the terminal sections of the plane coil are electrically connected with the electrode terminals of the semiconductor element. Further, the present invention relates to a process for manufacturing the non-contact type IC card. Furthermore, the present invention relates to the plane coil used for the non-contact type IC card.
2. Description of the Related Art
Referring to
FIG. 8
, the structure of a conventional non-contact type IC card
50
will be explained below.
The plane coil
52
is manufactured by winding a covered conductor wire, etching a layer of metallic foil formed on a resin film or punching a metallic sheet.
In order to reduce the thickness of the non-contact type IC card
50
, the semiconductor element
54
is arranged in the substantially same plane as that of the plane coil
52
at a position not overlapping with the plane coil
52
. The electrode terminals
56
of the semiconductor element
54
are electrically connected with the terminal sections
52
a
of the plane coil
52
by wires
58
. In this case, bonding wires and covered wires are included in the implications of the “wires” in this specification hereinafter.
Then, a pair of over-sheets
60
made of resin are attached onto both sides of the plane coil
52
and semiconductor element
54
. After that, the over-sheets
60
are heated and pressed, so that they can be integrated into one body. In this way, the non-contact type IC card
50
can be made. In this connection, when the wires
58
are composed of bonding wires, insulating material such as an insulating sheet is interposed between the wires
58
and the plane coil
52
so that an electrical insulating property can be ensured.
In the above arrangement, the thickness of the non-contact type IC card
50
is reduced by arranging the plane coil
52
and the semiconductor element
54
in such a manner that they are not overlapped with each other. However, in order to further reduce the thickness of the non-contact type IC card
50
, the thickness of the plane coil
52
itself and that of the semiconductor element
54
itself must be further reduced.
However, when the thickness of the plane coil
52
and that of the semiconductor element
54
are reduced, the mechanical strength of each component is deteriorated. This deterioration of the mechanical strength causes a serious problem. Especially, this deterioration of the mechanical strength causes a serious problem in the semiconductor element
54
, that is, when an external force is given to the semiconductor element
54
, there is a high possibility of damage to, or cracks in, the semiconductor element
54
.
SUMMARY OF THE INVENTION
The present invention has been accomplished to solve the above problems. It is an object of the present invention to provide a non-contact type IC card, the thickness of which is small, which is less susceptible to damage.
According to the present invention, there is provided an IC card comprising: a plane coil having respective terminal sections; a semiconductor element arranged at a position not overlapping with the plane coil, the semiconductor element having electrode terminals; means for electrically connecting the respective terminal sections of the plane coil to the electrode terminals of the semiconductor element; and a reinforcing frame arranged on a same face as that of the semiconductor element so that the semiconductor element is surrounded by the reinforcing frame.
Due to the foregoing, the semiconductor element is arranged inside the reinforcing frame. In other words, the semiconductor element is surrounded by the reinforcing frame. Therefore, the semiconductor element is protected when an external force is given to the semiconductor element. Accordingly, even if the thickness of the semiconductor element is reduced, no problems are caused, that is, there is no possibility that the semiconductor element is damaged.
If the reinforcing frame is composed in such a manner that the terminal sections of the plane coil are formed into a frame-shape, it becomes unnecessary to provide the reinforcing frame separately from the plane coil. Therefore, the number of parts can be reduced.
If the inside region of the reinforcing frame is filled with resin material by using the reinforcing frame as a guide, the semiconductor element can be protected by the resin, so that the possibility of damage of the semiconductor element can be reduced.
If the semiconductor element is arranged inside the plane coil, the dimensions of the non-contact type IC card can be reduced, which is advantageous for use in various technical fields in which small non-contact type IC cards are required.
The reinforcing frame comprises the respective terminal sections which constituted a frame-like configuration.
An inside region of the reinforcing frame is filled with a resin.
The semiconductor element is arranged at a position inside the plane coil.
The electrical connecting means comprises a circuit board extending from the terminal sections of the plane coil to the electrode terminals of the semiconductor element, the circuit board comprising an insulating resin film having first and second surfaces, the first surface facing to the semiconductor element, and circuit patterns formed on the second surface of the insulating resin film; and conductive bumps formed on the terminal sections of the plane coil and on the electrode terminals of the semiconductor element, respectively, the bumps projecting through the insulating resin film to the circuit patterns, so that the terminal sections of the plane coil are electrically connected to the electrode terminals of the semiconductor element by means of the circuit patterns.
Otherwise, the electrical connecting means comprises: an insulating resin film extending from the terminal sections of the plane coil to the electrode terminals of the semiconductor element, the insulating resin film having first and second surfaces, the first surface facing to the semiconductor element, the insulating resin film also having through holes at positions corresponding to the terminal sections of the plane coil and the electrode terminals of the semiconductor element; and circuit patterns, composed of conductive paste, formed on the second surface of the insulating resin film and having respective ends filled in the through holes, respectively, so that the terminal sections of the plane coil are electrically connected to the electrode terminals of the semiconductor element by means of the circuit patterns.
In another embodiment, an IC card further comprises an electrically insulating layer for covering the reinforcing frame, the semiconductor element and the plane coil, at a side of the electrode terminals of the semiconductor element; the electrical connecting means comprising:
an insulating resin film formed on said insulating layer extending from the terminal sections of the plane coil to the electrode terminals of the semiconductor element; the insulating resin film having first and second surfaces, the first surface facing to the semiconductor element;
the electrical insulating layer and the insulating resin film having through holes, penetrating therethrough, at positions corresponding to the terminal sections of the plane coil and the electrode terminals of the semiconductor element; and
circuit patterns, composed of conductive paste, formed on the second surface of the insulating resin film and having respective ends filled in the through holes, respectively, so that the terminal sections of the plane coil are electrically connected to the electrode terminals of the semiconductor element by means of the circuit patterns.
The electrical connecting means comprises: an insulating resin thin film extending from the terminal sections of the plane coil to the electrode terminals of the semiconductor element, the insulating resin film having fi
Akagawa Masatoshi
Fujii Tomoharu
Higuchi Tsutomu
Okamura Shigeru
Sato Tsuyoshi
Clark Jhihan B.
Pennie & Edmonds LLP
Shinko Electric Industries Co. Ltd.
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