Non-contact polishing of semiconductor materials

Details Non-contact polishing of semiconductor materials Non-contact polishing of semiconductor materials

1987-02-06

1988-03-29

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156638, 156642, 156662, 156345, H01L 21306, B44C 122

Patent

active

047341513

ABSTRACT:
The present invention discloses a non-contact technique of polishing semiconductor materials using an apparatus that produces a laminar flow of a polishing solution across the surface of the material to be polished.

REFERENCES:
patent: 2849296 (1958-08-01), Certa
patent: 3348987 (1967-10-01), Stark et al.
patent: 3629023 (1971-12-01), Strehlow
patent: 3677848 (1972-07-01), Stoller et al.
patent: 4468283 (1984-08-01), Ahmed
patent: 4482425 (1984-11-01), Battey

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