Non-contact cool-down station for wafers

Details Non-contact cool-down station for wafers Non-contact cool-down station for wafers

2005-04-26

2005-04-26

Doerrler, William C. (Department: 3744)

Drying and gas or vapor contact with solids

Process

Cooling by gas or vapor contact

C062S062000, C117S926000

Reexamination Certificate

active

06883250

ABSTRACT:
A stationary cooling station for cooling wafers after the wafers have been subjected to semiconductor processing supports the wafer by flowing gas in accordance with the Bernoulli principle. An upper wall of the cooling station contains a plurality of gas outlets that direct gas to flow over the top surface of the wafer. In this way, a low-pressure region is created over the wafer and the wafer is suspended within the cooling station, without directly contacting any surface for support. In addition to providing lift for the wafer, the gas is a thermally conductive gas that can cool the wafer by conducting heat away from it.

REFERENCES:
patent: 3961120 (1976-06-01), Hearn et al.
patent: 4148575 (1979-04-01), Siryj
patent: 4566726 (1986-01-01), Correnti et al.
patent: 4622918 (1986-11-01), Bok
patent: 4828224 (1989-05-01), Crabb et al.
patent: 4860687 (1989-08-01), Frijlink
patent: 4951601 (1990-08-01), Maydan et al.
patent: 4987856 (1991-01-01), Hey et al.
patent: 4990047 (1991-02-01), Wagner et al.
patent: 5080549 (1992-01-01), Goodwin et al.
patent: 5094013 (1992-03-01), Martin et al.
patent: 5135349 (1992-08-01), Lorenz et al.
patent: 5178639 (1993-01-01), Nishi
patent: 5180273 (1993-01-01), Sakaya et al.
patent: 5241758 (1993-09-01), Cruz et al.
patent: 5281320 (1994-01-01), Turner et al.
patent: 5320982 (1994-06-01), Tsubone et al.
patent: 5407449 (1995-04-01), Zinger
patent: 5445677 (1995-08-01), Kawata et al.
patent: 5458687 (1995-10-01), Shichida et al.
patent: 5464313 (1995-11-01), Ohsawa
patent: 5855465 (1999-01-01), Boitnott et al.
patent: 5855681 (1999-01-01), Maydan et al.
patent: 5863170 (1999-01-01), Boitnott et al.
patent: 5911461 (1999-06-01), Sauter et al.
patent: 5974682 (1999-11-01), Akimoto
patent: 6068089 (2000-05-01), Brooks et al.
patent: 6073366 (2000-06-01), Aswad
patent: 6097005 (2000-08-01), Akimoto
patent: 6111225 (2000-08-01), Ohkase et al.
patent: 6183183 (2001-02-01), Goodwin et al.
patent: 6183565 (2001-02-01), Granneman et al.
patent: 6203622 (2001-03-01), Halpin et al.
patent: 6209220 (2001-04-01), Raaijmakers
patent: 6215106 (2001-04-01), Boas et al.
patent: 6242718 (2001-06-01), Ferro et al.
patent: 6285102 (2001-09-01), Matsuoka et al.
patent: 6408537 (2002-06-01), Aswad
patent: 6443168 (2002-09-01), Morita et al.
patent: 20040092128 (2004-05-01), Grant et al.
patent: 3608783 (1987-09-01), None
patent: 0 829 904 (1998-03-01), None
patent: 2001-250788 (2000-12-01), None
patent: WO 9013687 (1990-11-01), None
patent: WO 9801890 (1998-01-01), None
patent: WO9903138 (1999-01-01), None
patent: WO 9903138 (1999-01-01), None

Affiliated with

Also associated with

Rating

Non-contact cool-down station for wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Non-contact cool-down station for wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Non-contact cool-down station for wafers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3421184