Nodular copper removal from aluminum foil surfaces

Details Nodular copper removal from aluminum foil surfaces Nodular copper removal from aluminum foil surfaces

1980-10-29

1982-06-29

Lesmes, George F.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156666, 252 791, 252 792, B44C 122

Patent

active

043371140

ABSTRACT:
Nodular copper is dissolved from aluminum foil surfaces by contacting the aluminum with a 0.1 to 2 M ammonium persulfate solution. The contacting temperature is 20.degree. to 40.degree. C., preferably 30.degree. C., and the contacting time is 1 to 10 minutes, preferably 2 minutes.

REFERENCES:
patent: 2168909 (1939-08-01), Mason
patent: 2795490 (1957-06-01), Newman et al.
patent: 3281293 (1966-10-01), Woodring
patent: 3399090 (1968-08-01), Caropreso et al.
patent: 3600245 (1971-08-01), Gates
patent: 3728237 (1973-04-01), Heijenbrok et al.
A. M. Lore, "Cleaning Copper Chemically-A Comparison", Insulation/Circuits 26, #3:41-44 (Mar. 1980).

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